Agityne manages technology development projects, including materials processing, MEMS/nano-systems and manufacturing systems.  Projects are done in collaboration with other organizations with complementary capabilities.

Currently one patent is available for licensing: US patent # 6,897,123 Bonding of parts with dissimilar thermal expansion coefficients.  The technology was developed specifically to solve some of the problems associated with bonding of silica wafers to metals in products experiencing large thermal fluctuations.  The patent can be found at:

http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6897123